Ultra-thin Chip Technology and Applications by Peter Stallhofer (auth.), Joachim Burghartz (eds.) PDF

By Peter Stallhofer (auth.), Joachim Burghartz (eds.)

ISBN-10: 1441972757

ISBN-13: 9781441972750

ISBN-10: 1441972765

ISBN-13: 9781441972767

Ultra-thin Chip expertise and purposes edited via: Joachim N. Burghartz Ultra-thin chip know-how has the aptitude to supply recommendations for overcoming bottlenecks in silicon know-how and for resulting in new functions. This ebook exhibits how very skinny and versatile chips will be fabricated and utilized in many new functions in microelectronics, microsystems, biomedical and different fields. It offers a accomplished connection with the fabrication expertise, submit processing, meeting, characterization, modeling and functions of ultra-thin chips. •Provides a accomplished evaluate of the demanding situations in ultra-thin chip fabrication, put up processing, houses and functions via leaders within the box sharing their most modern effects and ideas; •Compares strengths and weaknesses of 3 primary fabrication procedures for ultra-thin chips; •Describes digital, mechanical, optical, and thermal houses of ultra-thin chips which are assorted from these of traditional, thick chips; •Shows that skinny chip expertise and its purposes represents a brand new paradigm in silicon technology.

Show description

Read or Download Ultra-thin Chip Technology and Applications PDF

Best technology books

Design and Prototypes of Mobile Robots - download pdf or read online

For a number of many years now, cellular robots were indispensable to the advance of latest robot platforms for brand spanking new functions, even in nontechnical components. cellular robots have already been constructed for such makes use of as business automation, treatment, area exploration, demining operations, surveillance, leisure, museum courses and plenty of different business and non-industrial purposes.

Download e-book for kindle: Victorian Technology: Invention, Innovation, and the Rise of by Herbert Sussman

Victorian know-how: Invention, Innovation, and the increase of the computer captures the intense surge of power and invention that catapulted 19th-century England into the placement of the world's first industrialized country. It used to be an brilliant transformation, one who shaped—and used to be formed by—the values of the Victorian period, and that laid the foundation for the consumer-based society within which we at present stay.

Download e-book for iPad: Dredge Drain Reclaim: The Art of a Nation by Johan Van Veen

Through the profession of the Netherlands the Germans made it most unlikely to hold out any upkeep paintings on our beaches or any sounding, soil investiga­ tion or current-measurement paintings off the co ast, within the estuary of the Scheldt or within the channels among the Frisian Islands. The paintings ofDr. Johan van Veen, then chief of this survey, hence got here to astandstill.

New PDF release: Trade and Technology Networks in the Chinese Textile

The purpose of this e-book is to trace the old origins of China’s financial reforms. From the Nineteen Twenties and Nineteen Thirties powerful ties have been equipped among chinese language cloth industrialists and international equipment importers in Shanghai and the Yangzi Delta. regardless of the fragmentation of China, the contribution of those networks to the modernization of the rustic used to be very important and longstanding.

Additional resources for Ultra-thin Chip Technology and Applications

Example text

In the case of wafers of standard thickness micro defects are generally not an C. N. 1007/978-1-4419-7276-7_4, # Springer Science+Business Media, LLC 2011 33 34 C. Landesberger et al. issue, because the rigid silicon substrate prevents the propagation of flaws towards the transistor regions. For ultra-thin wafers such a ‘safety belt’ against breakage no longer exists. Micro cracks from any side of a semiconductor chip will run through the crystal lattice as soon as the substrate is strongly bent.

These applications benefit strongly from Moore’s law and are currently in the sub 100-nm regime. CMOS technology provides the platform for making the smallest possible feature size for electronic devices such as microprocessors, memory and logic circuits. Approximately 70–80% of silicon wafers are used in feature size critical CMOS applications. They are almost exclusively manufactured on 200-mm and 300-mm diameter wafers. 4 More than Moore Applications In addition to the wafers used in CMOS-based applications a further 20% of silicon wafers are used for discrete (as opposed to integrated) devices, which find applications in power electronic sensors and micro-electro-mechanical systems (MEMS).

Subsequently, backside thinning is performed until the frontside grooves are opened. Then separated thin dies will be transferred onto a tape, which allows for a pick-and-place process for final assembly. This basic concept allows for a variety of adaptations and variations. First, the frontside trenches may be prepared by half-cut sawing, wet etching or plasma etching. Reversible bonding of a rigid support substrate can be realised by releasable tapes, solvable glues or thermoplastic materials.

Download PDF sample

Ultra-thin Chip Technology and Applications by Peter Stallhofer (auth.), Joachim Burghartz (eds.)


by Kevin
4.1

Rated 4.34 of 5 – based on 20 votes